An effective PCB layout and design can get your products faster to market and grow your company’s bottom-line revenue.
TEFA Technologies harnesses the latest software to offer cost-effective PCB layout and design services that can be easily scaled based on your development cycles. Our priority is to ensure that your quality and performance goals are met on a timely basis so that your production can yield the best possible results. We only hire designers with advanced expertise in multi-layer, rigid, or flex PCB design services.
Irrespective of how complex or dense your layout design requirements are, our highly accurate PCB design approach takes care of compatibility and manufacturability before you enter bulk production mode.
- PCB Prototyping
- PCB Manufacturing
- PCB Reverse Engineering
TEFA Technologies understands that signal integrity and electrical performance are the lifeline of your business. Hence, we work with complex mixed technology stacks to eliminate your worries about DFM/DFA rules, routing availability or speed, and efficiency of layer stack-ups. With us, you get access to PCB design and layout services that are based on industry-leading design practices. Our competency levels are high across design tools like OrCAD, Cadence Allegro etc….
Domain
- Digital.
- Analog.
- RF.
- Power.
- Backplane.
- Flex & Rigid-Flex.
- HDI.
Expertise
- Signal integrity driven layer stacks and constraint driven placement and routing.
- Experienced with various DFM/DFA/DFT rules.
- High Density Interconnect (HDI): Microvia, blind and buried, via-in-pad, fine-line, buried capacitance.
- High-speed SERDES: 40Gbps+, wide memory interfaces (DDR3,4).
- Impedance and fiber weave direction control.
- Printed antennas and complex wireless routing, including guard trace signal protection.
- Types: Rigid, Flex, Rigid-Flex.
- Materials: FR4, Polyimide, high speed/low loss dielectrics, hybrid constructions (e.g. FR4/Rogers), RoHS.
- Layer counts: 2 to 40+.
Tools
- Cadence Allegro PCB Designer.