Circuit boards are constantly evolving, along with growing heating and cooling limits. The need of the hour for small-sized circuit boards that are built to perform with high densities.
TEFA Technologies delivers Power Integrity and Thermal Analysis services that ensure the hardware’s reliability to cope with new design features. We offer a thorough and accurate DC analysis to maximize your power delivery and sign off your PCB designs. With TEFA Technologies, you can effectively identify the density and thermal hotspots at the right time so that the chance of failure in your design is significantly reduced. Read More..